Abstract： IEC 61192-3:2002 pdf free download.Workmanship requirements for soldered electronic assemblies -Part 3: Through-hole mount assemblies. 3 Terms and definitions For the purposes of this part of IEC 61192. the definitions of IEC 60194 apply. 4...

IEC 61192-3:2002 pdf free download.Workmanship requirements for soldered electronic assemblies -Part 3: Through-hole mount

assemblies.

3 Terms and definitions

For the purposes of this part of IEC 61192. the definitions of IEC 60194 apply.

4 General requirements

The requirements of IEC 61192-1 are mandatory for this standard.

4.1 Classification

The classification of assemblies is divided into three levels, that is, levels A, B, and C.

Definitions of the classification calegories and the status of product for each level are given in IEC 61192.1 In general, status

is divided Into three workmanship conditions, as follows:

a) target:

b) acceptable;

C) nonconforming.

4.2 Conflict

Accept andior reject decisions shall be based on applicable documentation such as contracts, drawings, specifications and reference documents.

In the event of conflict, the following order of precedence shall apply:

a) procurement documents as agreed between user and supplier;

b) master assembly drawing;

C) 1EC61191-1 and IEC 61 192-1;

d) this standard:

e) other documents to the extent that they are specified in this standard.

4.3 Inspection techniques

For visual inspection, individual specifications may call for magnification aids for examining printed-board assemblies.

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