Abstract： IEC 61188-1-2:1998 pdf free download.Printed boards and printed board assemblies -Design and use - Part 1-2: Generic requirements -Controlled impedance. This part of IEC 61188 is intended to be used by circuit designers, packaging engineers...

IEC 61188-1-2:1998 pdf free download.Printed boards and printed board assemblies -Design and use - Part 1-2: Generic requirements -Controlled impedance.

This part of IEC 61188 is intended to be used by circuit designers, packaging engineers, printed board manufacturers and

procurement personnel so that all may have a common understanding of each area. The aim in packaging is to transfer a signal from

one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

2 Normative references

The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of

IEC 61188. At the time of publication, the editions indicated were valid, All normative documents are subject to revision, and

parties to agreements based on this part of IEC 61188 are encouraged to investigate the possibility of applying the most recent

editions of the normative documents listed below. Members of IEC and ISO maintain registers of currently valid international

standards.

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