Abstract： IEC 60191-5:1997 pdf free download.Mechanical standardizationof semiconductor devices -Part 5: Recommendations applying to integratedcircuit packages using tape automated bonding (TAB). This part of IEC 60191 on mechanical standardization g...

IEC 60191-5:1997 pdf free download.Mechanical standardizationof semiconductor devices -Part 5: Recommendations applying to

integratedcircuit packages using tape automated bonding (TAB).

This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages

using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is

applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to

tape interface (the inner lead bond or ILB).

2 Terms and definitions

For the purpose of this part of lEG 60191, the following definitions apply.

2.1 chip (or die): A portion of a silicon wafer which contains at least one integrated circuit which has been separated from the

wafer containing an array of such devices.

22 tape carrier1): A linear strip of a laminate of an insulating material and a conducting material patterned so as to mechanically support and electrically contact a chip. The strip may contain a series of such patterns and each such pattern is a tape site.

2.3 sprocket hole: A row of holes on each side of the tape carrier used for driving the tape through equipment or for coarse

alignment.

2.4 lead pattern: The pattern of etched conductive material on a tape carrier Including the inner and outer leads and the test

pads.

2.5 Inner lead: The extreme interior end of the lead pattern conductor which is used for connection to a chip.

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